Chip-design compiler keys on 2.5, 3D multi-die system-in-a-package developments

Synopsys introduced its 3DIC Compiler platform to transform the design and integration of complex 2.5 and 3D multi-die system in a package. It provides an unprecedented fully integrated, high-performance, and easy-to-use environment, offering architectural exploration, design, implementation, and signoff with signal, power, and thermal integrity optimizations, all in one solution. With 3DIC Compiler, IC design […] The post Chip-design compiler keys on 2.5, 3D multi-die system-in-a-package deve...